Financial Technology (FinTech)

AI@FinTech 2019 – Open Seminar 公開講座

The 1st Interschool Fintech Application and Innovation Competition (AI@FinTech 2019) aims to encourage students to learn science, technology, engineering and mathematics (STEM) in financial application and innovation of science and technology’s enthusiasm, improve students set up system model, the mathematical method and computing the comprehensive ability of solving practical problems, to encourage students to take part in the extra-curricular activities of science and technology, expand the knowledge level, cultivate creative spirit, get ready to the university’s life.


AI@FinTech 2019 – Open Seminar 公開講座

Date : May 11, 2019 (Saturday)
Time : 9:30am – 11:00am
Venue : Mong Man Wai Building (MMW_LT-1)


Bachelor of Engineering Programme in Financial Technology, CUHK