Organised by the Centre for Innovation and Technology and the Centre for Financial Engineering, CUHK, the Fintech Conference is a platform for discussions on AI and Machine Learning, Asset Management/Robo Advisory/Algo Trading, FinTech in the Banking/Investment Banking Industry, and ICO/Tokenization/Cryptocurrency, and RegTech.
Booth #5, Room 603, Ho Sin Hang Engineering Building and Room 612, William M.W.Mong Engineering Building (Financial Engineering Laboratory)
Presentations
(1) Admission talk for FinTech, 9:30am to 10:15am, Lecture Theater, 9/F, William M.W.Mong Engineering Building.(2) Admission talk for FinTech, 12:00pm to 12:45pm, T.Y. Wong Hall, 5/F, Ho Sin Hang Engineering Building.(3) Admission talk for FinTech, 1:30pm to 2:15pm, T.Y. Wong Hall, 5/F, Ho Sin Hang Engineering Building.
=> Photo Gallery Date: Saturday, October 20, 2018 – 08:30 to 18:00
SEEM and InvestHK organized the CUHK FinTech Seminar Series on November 1, 2017, as part of the FinTech Education Week
As part of the Hong Kong FinTech Education Week and supported by InvestHK, the Department of Systems Engineering and Engineering Management organized the FinTech seminar series at 4:00pm on November 1, 2017 Wednesday in YIA LT3, CUHK. The seminar series presents leading FinTech practitioners lecturing on recent advances and developments in the area.
Guest speakers include :
Mr. Charles d’Haussy, Head of FinTech, Invest Hong Kong, speaking about “Fintech Entrepreneurship in Hong Kong”
Mr. Louis Mak, Founder and Chief Executive Officer, I-Access Group and Director, Board of Hong Kong Securities and Investment Institute, speaking about “The Rise of P2P Financial Services”
Professor Helen Meng, Chairman, Department of Systems Engineering and Engineering Management. speaking about “Big Data Decision Analytics @CUHK”
and Mr. Chung Chi Wai, Manager, Fintech Facilitation Office, Hong Kong Monetary Authority, speaking about “Opportunities and Challenges of the FinTech Ecosystem in Hong Kong”
The inspiring talks were well attended by an active audience.